Manufacturing
X-ray Inspection
A non-destructive testing method used to inspect hidden solder joints, particularly in ball grid array (BGA) packages.
Example
Using X-ray inspection to verify proper solder ball formation under a BGA chip.
A non-destructive testing method used to inspect hidden solder joints, particularly in ball grid array (BGA) packages.
Using X-ray inspection to verify proper solder ball formation under a BGA chip.